We　propose　that　electroless　plating　is　a　superb　approach　to　preparing　metallic　bumps　with　an　ultrafine　pitch　for　the　integration　of　a　micro　light-emitting　diode　(micro-LED).　Electroless　plating　does　not　suffer　from　lift-off-related　issues,　which　are　ubiquitous　in　thermal　evaporation.　Besides,　it　can　result　in　much　more　uniform　bumps　than　electroplating　because　the　bump　height　is　not　affected　by　the　current　distribution.　This　study　reports　ultrafine　pitch　Ni/Au　bumps　fabricated　by　electroless　nickel　immersion　gold　(ENIG)　plating.　Furthermore,　cheap　metals　iron　and　nickel　are　selected　to　catalyze　the　electroless　nickel　process.　The　results　indicate　that　uniform　and　consistent　Ni/Au　bumps　can　be　obtained　through　the　iron　sheet　and　nickel　layer　method.　Besides,　no　voids　and　impurities　are　found　inside　the　bumps,　which　is　beneficial　for　the　following　interconnection　process.　Moreover,　the　change　in　Ni　bump　height　values　with　the　electroless　plating　time　is　also　provided.　©　2016　American　Chemical　Society.