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author:

Li, Z. (Li, Z..) [1] | Ding, X. (Ding, X..) [2] | Chen, L. (Chen, L..) [3] | He, J. (He, J..) [4] | Chen, J. (Chen, J..) [5] | Hua, N. (Hua, N..) [7] | Dai, P. (Dai, P..) [8] | Tang, Q. (Tang, Q..) [9]

Indexed by:

Scopus

Abstract:

In the present study, FeCoCrNiMnSix (x = 0, 0.1, and 0.2, molar ratio) high-entropy alloys (HEAs) were prepared via arc melting, and subsequently deformed via cold rolling and annealing (CRA). The effects of Si content and annealing temperature on the microstructural evolution and tensile properties of the alloys were systematically investigated. The results indicate that a single-phase FCC structure of coarse-grained FeCoCrNiMnSix HEAs was obtained after homogenized annealing (HOA), and the distribution of each element was uniform. When the molar ratio of Si was increased from 0 to 0.2, the strength of the HOA HEAs increased by nearly 50%, and the elongation did not decrease, largely due to solid solution strengthening and the reduction in stacking fault energy. Conversely, as Si content increased, the recrystallization ratio decreased during annealing. A heterogeneous grain structure composed of recrystallized and residual deformation regions (high density of dislocations and deformation twinning) was obtained by changing the CRA temperature and Si content. A heterogeneous grain structure of CRA HEAs with an annealing temperature of 700 ℃ and Si content of 0.2 exhibits approximately fourfold higher yield strength (733 MPa) compared to that of HOA FeCoCrNiMn HEAs (185.27 MPa). The structure's tensile strength and ductility were measured at 959 MPa and 29.5%, respectively. The high strength was mainly attributed to the combined effect of multiple strengthening mechanisms. Heterogeneous deformation-induced strain hardening and twinning-induced plasticity provide good ductility. © 2022 Elsevier B.V.

Keyword:

Annealing temperature High entropy alloys Microstructure Si addition Tensile properties

Community:

  • [ 1 ] [Li, Z.]College of Materials Science and Engineering, Fuzhou University, Fuzhou, 350116, China
  • [ 2 ] [Li, Z.]College of Materials Science and Engineering, Fujian University of Technology, Fuzhou, 350118, China
  • [ 3 ] [Ding, X.]College of Materials Science and Engineering, Fujian University of Technology, Fuzhou, 350118, China
  • [ 4 ] [Ding, X.]Fujian Provincial Key Laboratory of New Material Preparation and Forming Technology, Fuzhou, 350108, China
  • [ 5 ] [Chen, L.]College of Materials Science and Engineering, Fuzhou University, Fuzhou, 350116, China
  • [ 6 ] [He, J.]College of Materials Science and Engineering, Fujian University of Technology, Fuzhou, 350118, China
  • [ 7 ] [He, J.]Fujian Provincial Key Laboratory of New Material Preparation and Forming Technology, Fuzhou, 350108, China
  • [ 8 ] [Chen, J.]College of Materials Science and Engineering, Fuzhou University, Fuzhou, 350116, China
  • [ 9 ] [Chen, J.]Department of Material Science and Engineering, Guangdong Technion-Israel Institute of Technology, Shantou, 515063, China
  • [ 10 ] [Hua, N.]College of Materials Science and Engineering, Fujian University of Technology, Fuzhou, 350118, China
  • [ 11 ] [Hua, N.]Fujian Provincial Key Laboratory of New Material Preparation and Forming Technology, Fuzhou, 350108, China
  • [ 12 ] [Dai, P.]College of Materials Science and Engineering, Fuzhou University, Fuzhou, 350116, China
  • [ 13 ] [Dai, P.]College of Materials Science and Engineering, Fujian University of Technology, Fuzhou, 350118, China
  • [ 14 ] [Dai, P.]Fujian Provincial Key Laboratory of New Material Preparation and Forming Technology, Fuzhou, 350108, China
  • [ 15 ] [Tang, Q.]School of Mechanical & Electrical Engineering, Putian University, Putian, 351100, China

Reprint 's Address:

  • [Dai, P.]College of Materials Science and Engineering, China;;[Tang, Q.]School of Mechanical & Electrical Engineering, China

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Source :

Journal of Alloys and Compounds

ISSN: 0925-8388

Year: 2023

Volume: 935

5 . 8

JCR@2023

5 . 8 0 0

JCR@2023

ESI HC Threshold:49

JCR Journal Grade:1

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 16

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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