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author:

Liu, Miao (Liu, Miao.) [1] | Chen, Kexin (Chen, Kexin.) [2] | Shi, Yongqian (Shi, Yongqian.) [3] | Wang, Hengrui (Wang, Hengrui.) [4] | Wu, Shijie (Wu, Shijie.) [5] | Huang, Ruizhe (Huang, Ruizhe.) [6] | Feng, Yuezhan (Feng, Yuezhan.) [7] | Tang, Longcheng (Tang, Longcheng.) [8] | Liu, Xiaohuan (Liu, Xiaohuan.) [9] | Song, Pingan (Song, Pingan.) [10]

Indexed by:

EI CSCD

Abstract:

High-performance multifunctional polymeric materials integrated with high fire safety, excellent mechanical performances and electromagnetic interference (EMI) shielding properties have great prospects in practical applications. However, designing highly fire-safe and mechanically robust EMI shielding nanocomposites remains a great challenge. Herein, hierarchical thermoplastic polyurethane/cyclophosphazene functionalized titanium carbide/carbon fiber fabric (TPU/CP-Ti3C2Tx/CF) nanocomposites with high fire safety and mechanical strength and toughness were prepared through the methods of melt blending, layer-by-layer stacking and thermocompression. The TPU/CP-Ti3C2Tx showed improved thermal stability. Moreover, the peak of heat release rate and total heat release of the hierarchical TPU sample containing 4.0 wt.% CP-Ti3C2Tx were respectively reduced by 64.4% and 31.8% relative to those of pure TPU, which were far higher than those of other TPU-based nanocomposites. The averaged EMI shielding effectiveness value of the hierarchical TPU/CP-Ti3C2Tx-2.0/CF nanocomposite reached 30.0 dB, which could satisfy the requirement for commercial applications. Furthermore, the tensile strength of TPU/CP-Ti3C2Tx-2.0/CF achieved 43.2 MPa, and the ductility and toughness increased by 28.4% and 84.3% respectively compared to those of TPU/CF. Interfacial hydrogen bonding in combination with catalytic carbonization of CP-Ti3C2Tx nanosheets and continuous conductive network of CF were responsible for the superior fire safety, excellent EMI shielding and outstanding mechanical performances. This work offers a promising strategy to prepare multifunctional TPU-based nanocomposites, which have the potential for large-scale application in the fields of electronics, electrical equipment and 5 G facilities. © 2023

Keyword:

Blending Carbonization Electromagnetic pulse Electromagnetic shielding Electromagnetic wave interference Fires Hydrogen bonds Nanocomposites Signal interference Tensile strength Titanium carbide

Community:

  • [ 1 ] [Liu, Miao]College of Environment and Safety Engineering, Fuzhou University, Fuzhou; 350116, China
  • [ 2 ] [Chen, Kexin]College of Environment and Safety Engineering, Fuzhou University, Fuzhou; 350116, China
  • [ 3 ] [Shi, Yongqian]College of Environment and Safety Engineering, Fuzhou University, Fuzhou; 350116, China
  • [ 4 ] [Wang, Hengrui]College of Environment and Safety Engineering, Fuzhou University, Fuzhou; 350116, China
  • [ 5 ] [Wu, Shijie]College of Environment and Safety Engineering, Fuzhou University, Fuzhou; 350116, China
  • [ 6 ] [Huang, Ruizhe]College of Environment and Safety Engineering, Fuzhou University, Fuzhou; 350116, China
  • [ 7 ] [Feng, Yuezhan]Key Laboratory of Materials Processing and Mold Ministry of Education, National Engineering Research Center for Advanced Polymer Processing Technology, Zhengzhou University, Zhengzhou; 450002, China
  • [ 8 ] [Tang, Longcheng]Key Laboratory of Organosilicon Chemistry and Material Technology of Ministry of Education, College of Material, Chemistry and Chemical Engineering, Hangzhou Normal University, Hangzhou; 311121, China
  • [ 9 ] [Liu, Xiaohuan]College of Life Science, Zhejiang Provincial Key Laboratory of Plant Evolutionary Ecology and Conservation, Taizhou University, Taizhou; 318000, China
  • [ 10 ] [Song, Pingan]Centre for Future Materials, University of Southern Queensland, Springfield; QLD; 4350, Australia
  • [ 11 ] [Song, Pingan]School of Agriculture and Environmental Science, University of Southern Queensland, Springfield; 4300, Australia

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Source :

Journal of Materials Science and Technology

ISSN: 1005-0302

Year: 2023

Volume: 166

Page: 133-144

1 1 . 2

JCR@2023

1 1 . 2 0 0

JCR@2023

ESI HC Threshold:49

JCR Journal Grade:1

CAS Journal Grade:1

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 49

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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