Polyimide　(PI)　is　widely　used　in　the　communication　field　benefited　from　its　low　dielectric　properties　and　good　electrical　insulating　properties,　however,　its　low　thermal　conductivity　simultaneously　limits　its　application　in　electronic　packaging.　Delayed　heat　dissipation　can　exacerbate　the　thermal　stress　generated　by　device　operation　to　damage　electronic　structures,　thereby　affecting　work　efficiency.　As　a　result,　it　is　necessary　to　improve　the　thermal　conductivity　of　polyimide　and　maintain　excellent　dielectric　performance.　Here,　we　demonstrate　the　polyimide　(BPDA-ODA)　composites　with　ordered　structure　are　prepared　by　filling　commercial　polyimides　with　aramid　nanofibers　connection　nitrides　greatly　improve　thermal　conductivity　and　maintain　the　low　dielectric　loss.　When　the　filling　amount　of　SBN@CN　is　30　wt%,　the　thermal　conductivity　increases　to　1.162　W/mK,　which　is　8　times　higher　than　that　of　pure　PI　(0.0147　W/mK).　Moreover,　thermal　stability　and　mechanical　properties　are　maintained,　realizing　that　the　dielectric　constant　is　about　3.81　and　the　dielectric　loss　is　as　low　as　0.0034　at　100　MHz,　which　endows　a　new　insight　for　the　application　of　polyimide　in　electronic　packaging.