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Elastic disordered microcellular metal rubber (EDMMR) is a lightweight metal material widely employed for damping or support in high-temperature environments, addressing the limitations of traditional polymer rubbers. Herein, three sets of solid finite element models of EDMMR with different relative densities are developed using virtual manufacturing technology (VMT). Thermal-mechanical coupled finite element simulations explore the dynamic evolution of two typical spatial topological structures in the material's microstructure: unit contact characteristics and angle distribution under temperature variations. Results indicate that the mechanical performance of the material under high-temperature loads exhibits distinct spatial topological structures compared to those at room temperature. At 100, 200, and 300 degrees C, the material experiences internal stress distributions of up to 0.5, 1.2, and 1.8 MPa, respectively, due to expansion. Additionally, during the initial loading stage, stress differentials of approximately 0.4 MPa are observed between different temperatures due to boundary effects. Furthermore, the study investigates the probability density distribution of typical microstructural combinations of EDMMR along the forming direction based on VMT, enhancing the generality of the constitutive model. Finally, three groups of EDMMR samples with different relative densities are prepared using standardized processes, and the model is validated through high-temperature quasistatic compression experiments. Mechanical behavior of elastic disordered microcellular metal rubber under varied temperatures is explored using virtual manufacturing technology and finite-element analysis. The microscale analysis unveils the influence of temperature on internal attributes and microspring angles, facilitating the development of a constitutive model that establishes a correlation between elevated-temperature macroscopic geometry and material properties.image (c) 2023 WILEY-VCH GmbH
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ADVANCED ENGINEERING MATERIALS
ISSN: 1438-1656
Year: 2023
Issue: 23
Volume: 25
3 . 4
JCR@2023
3 . 4 0 0
JCR@2023
JCR Journal Grade:2
CAS Journal Grade:4
Cited Count:
WoS CC Cited Count: 3
SCOPUS Cited Count: 3
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count:
Chinese Cited Count:
30 Days PV: 3
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