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author:

Zhang, D. (Zhang, D..) [1] | Tao, T. (Tao, T..) [2] | Zhi, T. (Zhi, T..) [3] | Zhuang, Z. (Zhuang, Z..) [4] | Xu, F. (Xu, F..) [5] | Sang, Y. (Sang, Y..) [6] | Yu, J. (Yu, J..) [7] | Yan, Y. (Yan, Y..) [8] | Tian, K. (Tian, K..) [9] | Zhang, Z.-H. (Zhang, Z.-H..) [10] | Zhang, J. (Zhang, J..) [11] | Liu, B. (Liu, B..) [12]

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Scopus

Abstract:

The alternating current (ac)-driven GaN-based single contact light-emitting diode (SC-LED) has garnered significant attention due to its unique driving technique and potential applications, especially in areas where direct current-driven (dc-driven) LEDs face limitations. Our previous research emphasizes the importance of reducing the operating voltage of SC-LED. In this study, we have developed and manufactured a novel SC-LED featuring a tunnel junction (TJ) structure, which exhibits a lower breakdown voltage (Vbreakdown) compared to conventional LEDs with an ITO contact layer. The simulation and experimental data illustrate a significant performance gap between TJ SCLED and ITO SC-LED. The working voltage of TJ SC-LED is 34 V, which is 29% lower than that of ITO SC-LED. Specifically, under ac power at 80 V, TJ SC-LED exhibits a current of 0.94 mA and a WPE of 3.22%, both higher than the 0.77 mA and 3.02% values recorded for the ITO SC-LED. This comparison underscores the superior per-formance of TJ SC-LED over ITO SC-LED. These findings enhance our understanding of SC-LEDs and pave the way for the advancement of new driving techniques in nanosized displays.  © 1963-2012 IEEE.

Keyword:

Alternating current (ac)-drive GaN micro-light-emitting diode (LED) tunnel junction (TJ)

Community:

  • [ 1 ] [Zhang D.]Nanjing University, Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials, School of Electronic Science and Engineering, Nanjing National Laboratory of Microstructures, Nanjing, 210093, China
  • [ 2 ] [Tao T.]Nanjing University, Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials, School of Electronic Science and Engineering, Nanjing National Laboratory of Microstructures, Nanjing, 210093, China
  • [ 3 ] [Zhi T.]Nanjing University of Posts and Telecommunications, College of Electronic and Optical Engineering, Nanjing, 210023, China
  • [ 4 ] [Zhuang Z.]Nanjing University, School of Integrated Circuits, Suzhou, 215163, China
  • [ 5 ] [Xu F.]Nanjing University, Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials, School of Electronic Science and Engineering, Nanjing National Laboratory of Microstructures, Nanjing, 210093, China
  • [ 6 ] [Sang Y.]Nanjing University, Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials, School of Electronic Science and Engineering, Nanjing National Laboratory of Microstructures, Nanjing, 210093, China
  • [ 7 ] [Yu J.]Nanjing University, Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials, School of Electronic Science and Engineering, Nanjing National Laboratory of Microstructures, Nanjing, 210093, China
  • [ 8 ] [Yan Y.]Nanjing University, Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials, School of Electronic Science and Engineering, Nanjing National Laboratory of Microstructures, Nanjing, 210093, China
  • [ 9 ] [Tian K.]Guangdong University of Technology, School of Integrated Circuits, Guangdong, Guangzhou, 510006, China
  • [ 10 ] [Zhang Z.-H.]Guangdong University of Technology, School of Integrated Circuits, Guangdong, Guangzhou, 510006, China
  • [ 11 ] [Zhang J.]Minjiang University, International Digital Economy College, Fuzhou, 350108, China
  • [ 12 ] [Zhang J.]Fuzhou University, College of Physics and Information Engineering, Fuzhou, 350108, China
  • [ 13 ] [Liu B.]Nanjing University, Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials, School of Electronic Science and Engineering, Nanjing National Laboratory of Microstructures, Nanjing, 210093, China

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Source :

IEEE Transactions on Electron Devices

ISSN: 0018-9383

Year: 2024

Issue: 9

Volume: 71

Page: 5546-5551

2 . 9 0 0

JCR@2023

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ESI Highly Cited Papers on the List: 0 Unfold All

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Chinese Cited Count:

30 Days PV: 2

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