UV-curing　low　dielectric　materials　exhibit　wide　applications　in　the　field　of　additive　manufacturing　of　electronic　packaging,　owing　to　their　environmental　protection,　good　thermal　stability,　low　dielectric　constant　(D-k),　and　dielectric　loss　(D-f).　Wherein,　one-step　UV　curing　realizes　process　simplification　of　low　dielectric　materials　gradually　sparked　widespread　research.　In　this　work,　a　series　of　novel　naphthalene-based　low　dielectric　materials　were　prepared　for　one-step　UV　curing.　The　double　bond　conversion　rate　of　resins　exceeds　90　%　in　a　short　time　and　the　resins　perform　exceptional　dielectric　properties　(D-k　＜　2.8,　D-f　＜　0.009,　110　MHz),　high　thermal　stability　(T-5%　＞　270　degrees　C),　and　hydrophobicity　(water　contact　angle　＞　95　degrees).　Notably,　1,6-naphthalene　dimethacrylate/Trihydroxymethylbutyl　trimethylacrylate　(1,6-NEA/TMPTA)　suggests　lowest　dielectric　performance　(D-k　=　2.19,　D-f　=　0.005)　with　significant　thermal　stability　(T-g　=　190　degrees　C,　T-5%　=　367.4　degrees　C)　because　the　pi-pi　conjugation　of　the　asymmetric　structure　of　1,6-NEA,　which　allows　for　a　greater　variety　of　stacking　patterns　and　increases　the　effective　collisions　between　the　reactive　sites　of　the　photosensitive　monomer　and　the　reactive　diluent.　This　work　has　revealed　the　structure-activity　relationship　between　the　substituents　on　naphthalene　derivatives　and　their　photochemical　properties,　providing　a　novel　methodology　for　the　development　of　low　dielectric　electronic　packaging　materials　through　additive　manufacturing　techniques.