Preparation of Bumps Using a Novel Photosensitive Conductive Polymer Material for Micro-LED Display Application - Details

author：

Indexed by：

Scopus

Abstract：

Micro-light-emitting　diode　(Micro-LED)　is　increasingly　favored　due　to　their　significant　advantages　in　the　performance　of　emerging　augmented　reality　(AR)　or　virtual　reality　(VR)　displays.　A　key　process　of　single-chip　integration　technology　in　high-density　micro　displays　is　the　interconnection　process,　which　is　closely　related　to　the　quality　of　display　devices.　The　traditional　chip　interconnection　is　mainly　achieved　by　preparing　metal-based　bump,　which　requires　metal　evaporation　after　photolithography,　increases　the　process　flow　complexity,　and　poses　a　risk　of　photoresist　peeling　off.　To　solve　these　problems,　we　use　a　new　type　of　photosensitive　conductive　polymer　material　to　prepare　bump　that　has　conductivity　and　can　directly　interconnect　chips　vertically.　Therefore,　this　method　can　eliminate　the　process　of　metal　evaporation　and　reduce　experimental　risks.　The　results　indicate　that　by　optimizing　the　process　parameters,　bumps　with　high　uniformity　can　be　successfully　prepared.　This　material　can　simplify　the　process　flow　and　improve　the　success　of　subsequent　vertical　interconnection　steps.　©　2024　IEEE.

Keyword：

Community：

[ 1 ] [Yang Y.]College of Physics and Information Engineering, Fuzhou University, National and Local United Engineering Laboratory of Flat Panel Display Technology, Fuzhou, 350100, China
[ 2 ] [Yang T.]Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
[ 3 ] [Zhu X.]College of Physics and Information Engineering, Fuzhou University, National and Local United Engineering Laboratory of Flat Panel Display Technology, Fuzhou, 350100, China
[ 4 ] [Lin C.]Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
[ 5 ] [Huang X.]College of Physics and Information Engineering, Fuzhou University, National and Local United Engineering Laboratory of Flat Panel Display Technology, Fuzhou, 350100, China
[ 6 ] [Sun J.]College of Physics and Information Engineering, Fuzhou University, National and Local United Engineering Laboratory of Flat Panel Display Technology, Fuzhou, 350100, China
[ 7 ] [Sun J.]Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
[ 8 ] [Sun J.]Chalmers University of Technology, Quantum Device Physics Laboratory, Department of Microtechnology and Nanoscience, Gothenburg, 41296, Sweden
[ 9 ] [Yan C.]Library of Fuzhou University, Department of Information and Automation, Fuzhou, 350108, China
[ 10 ] [Yan Q.]College of Physics and Information Engineering, Fuzhou University, National and Local United Engineering Laboratory of Flat Panel Display Technology, Fuzhou, 350100, China
[ 11 ] [Yan Q.]Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China

Reprint 's Address：

Email：

Show more details

Related Keywords：

Source ：

Year： 2024

Page： 30-33

Language： English

Cited Count：

WoS CC Cited Count：

SCOPUS Cited Count：

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 3

Affiliated Colleges：

物理与信息工程学院、微电子学院本学院/部未明确归属的数据

图书馆本学院/部未明确归属的数据

Get Fulltext

DOI Library Discovery Baidu Scholar Search SCOPUS

Type
Departments

All Years Choose Year From to