It　is　a　great　challenge　to　produce　ultra-smooth　surface　of　sapphire　wafers　at　high　material　removal　rate　(MRR)　using　green　slurry　in　semi-fixed　abrasive　polishing.　A　novel　environmentally　friendly　polishing　slurry　was　developed　by　preparing　abrasives　and　complexing　agents　to　improve　surface　quality　and　polishing　efficiency.　The　SiO2　and　diamond/SiO2　composite　abrasives　were　successfully　prepared　by　a　simplified　sol-gel　strategy,　exhibiting　high　purity,　homogeneous　particle　size,　and　excellent　dispersibility.　Based　on　the　semi-fixed　polishing　technology,　the　green　polishing　performance　of　sapphire　wafers　using　different　types　of　abrasives　alone　and　in　combination　with　complexing　agents　was　investigated.　The　experimental　results　demonstrated　that　the　novel　slurry　containing　triisopropanolamine　(TIPA)　and　diamond/SiO2　composite　abrasive　had　superior　polishing　performance.　Compared　with　the　traditional　diamond　slurry,　the　surface　roughness　of　the　novel　slurry　was　reduced　by　24.4　%　to　6.2　nm　(Ra),　while　the　MRR　was　increased　by　65.4　%.　Through　electrochemical　experiments,　molecular　simulations,　and　infrared　analysis,　the　improved　polishing　performance　of　the　composite　abrasives　with　TIPA　may　be　attributed　to　the　complexation　of　TIPA　and　the　optimization　of　interfacial　contact　behavior.　The　analysis　of　wear　debris　and　polished　sapphire　wafer　surface　further　pointed　out　that　the　deformation　reduced　the　indentation　depth　while　enhancing　the　reactivity　of　the　friction　chemistry.　The　diamond/　SiO2　composite　abrasives　with　TIPA　slurry　accelerated　the　generation　and　removal　of　the　reaction　layer　consisting　of　AlOOH,　Al-OH,　and　Al2Si2O7,　realizing　the　optimal　synergy　between　mechanical　wear　and　tribochemistry,　which　significantly　improved　the　polishing　quality.