The　advent　of　3-D　NAND　architecture　has　introduced　new　integration　challenges,　particularly　regarding　the　impact　of　thermal-mechanical　stress　during　manufacturing,　which　significantly　affects　device　performance.　This　study　establishes　a　3-D　NAND　flash　memory　process　mechanics　model　using　a　local　representative　volume　element　(RVE)　finite　element　modeling　framework.　We　thoroughly　analyze　the　causes　of　warpage　during　the　3-D　NAND　manufacturing　process　and　monitor　the　evolution　of　mechanical　stress　and　related　structural　deformations.　Additionally,　we　examine　the　deformation　distribution　under　sequential　processes　and　investigate　how　different　process　conditions　impact　asymmetric　deformation.　Our　findings　have　potential　significance　for　improving　device　structure　reliability　and　optimizing　process　parameters　in　3-D　NAND　memory　manufacturing.　By　providing　insights　into　stress　evolution　and　deformation　mechanisms,　this　work　contributes　to　addressing　the　challenges　associated　with　increasing　storage　density　in　3-D　NAND　technology.　©　1963-2012　IEEE.