The　roughening　layer　on　the　electrolytic　copper　foil　is　crucial　to　the　performance　of　printed　circuit　boards　(PCBs).　Additives　provide　a　straightforward　and　efficient　method　for　improving　the　performance　of　the　copper　foil　roughening　layer.　This　study　introduces　N,N-dimethyl-dithiocarbamate　propanesulfonate　(DPS)　for　the　first　time　as　an　electrochemical　roughening　additive　for　copper　foils.　The　effect　of　DPS　concentration　on　roughening　morphology　and　copper　deposition　was　investigated　using　techniques　such　as　scanning　electron　microscopy　(SEM),　atomic　force　microscopy　(AFM),　cyclic　voltammetry　(CV),　linear　sweep　voltammetry　(LSV),　electrochemical　impedance　spectroscopy　(EIS),　and　chronoamperometry　(CA).　In　addition,　density　functional　theory　(DFT)　calculations,　in　situ　Raman　spectroscopy,　and　electrochemical　quartz　crystal　microbalance　(EQCM)　were　employed　to　examine　the　adsorption　interactions　between　DPS,　the　copper　substrate,　and　copper　ions.　At　a　concentration　of　20　mg/L,　the　copper　foil　roughening　layer　exhibited　significant　improvement　in　morphology,　resulting　in　the　successful　preparation　of　a　high-volume　low-profile　(HVLP)　copper　foil.　The　roughening　layer　achieved　an　R　Z　value　as　low　as　1.09　mu　m　and　a　peel　strength　of　1.02　N/mm.