The　construction　of　intermetallic　compounds　(IMCs)　connection　layers　with　special　compositions　by　adding　small　amounts　of　alloying　elements　has　been　proven　to　be　an　effective　strategy　for　improving　the　reliability　of　electronic　component　interconnect.　However,　the　synergistic　effect　mechanism　of　multi-component　alloy　compositions　on　the　growth　behavior　of　IMCs　is　not　clear.　Herein,　we　successfully　prepared　a　new　quaternary　alloy　solder　with　a　composition　of　Sn-0.7Cu-0.175Pt-0.025Al　(wt%)　using　the　high-throughput　screening　(HTS)　method.　The　results　showed　that　it　possesses　excellent　welding　performance　with　an　inhibition　rate　over　40%　on　the　growth　of　IMCs　layers.　For　Cu6Sn5,　the　co-doping　of　Al　and　Pt　not　only　greatly　improves　its　thermodynamic　stability,　but　also　effectively　suppresses　the　phase　transition.　Meanwhile,　the　co-doping　of　Al　and　Pt　also　significantly　delays　the　generation　time　of　Kirkendall　defects.　The　substitution　sites　of　Al　and　Pt　in　Cu6Sn5　have　been　explored　using　atomic　resolution　imaging　and　advanced　data　informatics,　indicating　that　Al　and　Pt　preferentially　substitute　Sn　and　Cu　atoms,　respectively,　to　generate　(Cu,　Pt)6(Sn,　Al)5.　A　one-dimensional　(1D)　kinetic　model　of　the　IMCs　layer　growth　at　the　Sn　solder/Cu　substrate　interface　was　derived　and　validated,　and　the　results　showed　that　the　error　of　the　derived　mathematical　model　is　less　than　5%.　Finally,　the　synergistic　mechanism　of　Al　and　Pt　co-doping　on　the　growth　rate　of　Cu6Sn5　was　further　elucidated.　This　work　provides　a　feasible　route　for　the　design　and　development　of　multi-component　alloy　solders.　©　Youke　Publishing　Co.,Ltd　2025.