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author:

Deng, Renxia (Deng, Renxia.) [1] | Huang, Yi (Huang, Yi.) [2] | Lu, Yusheng (Lu, Yusheng.) [3] | Chen, Bin (Chen, Bin.) [4] | Zhong, Shenghong (Zhong, Shenghong.) [5] | Jiang, Huaide (Jiang, Huaide.) [6] | Yu, Yan (Yu, Yan.) [7]

Indexed by:

Scopus SCIE

Abstract:

Polymetallic electrocatalysts represent as a promising strategy for steering the electrocatalytic CO2 reduction reactions (eCO(2)RR) toward valuable products. However, achieving simultaneous high selectivity and activity remains challenging. Here, we report a dual-doped CuO catalyst (CuO-Sn-0.02-Ga-0.005) that synergistically combines Sn and Ga to achieve exceptional performance for CO2-to-CO conversion. Electrochemical evaluations demonstrate that the optimized catalyst exhibits a Faradaic efficiency (FE) of 99.37 % for CO at -0.7 V-RHE with a current density of -132.8 mA cm(-2), significantly outperforming pristine CuO (54.21 %, -47.6 mA cm(-2) and single-doped counterparts (93.50 %, -55.3 mA cm(-2) for CuO-Sn-0.02 and 46.76 %, -94.2 mA cm(-2) for CuO-Ga-0.02, respectively). Sn doping suppresses hydrogen evolution and enhances CO selectivity, while Ga doping boosts catalytic activity. In situ Raman spectroscopy reveals that Sn incorporation facilitates the stabilization of key intermediates (e.g., *COOH), whereas Ga introduces lattice strain and defects, enlarging the electrochemically active surface area. The catalyst also demonstrates remarkable stability, maintaining >95 % FE for CO over 75 h. This work provides a rational design strategy for non-precious metal catalysts through dual-element doping, highlighting the critical role of electronic and structural modulation in eCO(2)RR.

Keyword:

CO2 reduction Cu-based catalysts Dual doping In situ Raman spectroscopy Synergistic effects

Community:

  • [ 1 ] [Deng, Renxia]Fuzhou Univ, Coll Mat Sci & Engn, Key Lab Adv Mat Technol, Fuzhou 350108, Peoples R China
  • [ 2 ] [Huang, Yi]Fuzhou Univ, Coll Mat Sci & Engn, Key Lab Adv Mat Technol, Fuzhou 350108, Peoples R China
  • [ 3 ] [Lu, Yusheng]Fuzhou Univ, Coll Mat Sci & Engn, Key Lab Adv Mat Technol, Fuzhou 350108, Peoples R China
  • [ 4 ] [Chen, Bin]Fuzhou Univ, Coll Mat Sci & Engn, Key Lab Adv Mat Technol, Fuzhou 350108, Peoples R China
  • [ 5 ] [Zhong, Shenghong]Fuzhou Univ, Coll Mat Sci & Engn, Key Lab Adv Mat Technol, Fuzhou 350108, Peoples R China
  • [ 6 ] [Yu, Yan]Fuzhou Univ, Coll Mat Sci & Engn, Key Lab Adv Mat Technol, Fuzhou 350108, Peoples R China
  • [ 7 ] [Jiang, Huaide]Xinjiang Univ, Sch Mech Engn, Urumqi 830046, Peoples R China

Reprint 's Address:

  • [Zhong, Shenghong]Fuzhou Univ, Coll Mat Sci & Engn, Key Lab Adv Mat Technol, Fuzhou 350108, Peoples R China;;[Yu, Yan]Fuzhou Univ, Coll Mat Sci & Engn, Key Lab Adv Mat Technol, Fuzhou 350108, Peoples R China;;[Jiang, Huaide]Xinjiang Univ, Sch Mech Engn, Urumqi 830046, Peoples R China

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Source :

ELECTROCHIMICA ACTA

ISSN: 0013-4686

Year: 2025

Volume: 535

5 . 5 0 0

JCR@2023

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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