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author:

Han, Xueli (Han, Xueli.) [1] | Xu, Xiaorui (Xu, Xiaorui.) [2] | Wang, Zhengbo (Wang, Zhengbo.) [3] | Yang, Hanchao (Yang, Hanchao.) [4] | Chen, Desen (Chen, Desen.) [5] | Deng, Yicong (Deng, Yicong.) [6] | Chen, Duanyang (Chen, Duanyang.) [7] | Zhang, Haizhong (Zhang, Haizhong.) [8] | Qi, Hongji (Qi, Hongji.) [9]

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EI

Abstract:

In this work, a vertical gallium oxide (Ga2O3) Schottky barrier diode (SBD) with suspended field plate-assisted shallow mesa termination (SFPM-SBD) is proposed and fabricated. The suspended field plate is achieved by using Cl2 in the ICP etching process to facilitate isotropic etching of Ga2O3. Compared with shallow mesa SBD, the introduction of SFPM can further optimize the electric field (E_Field) distribution. Consequently, a high breakdown voltage (BV) of over 3.5 kV and a low specific on-resistance of 5.77 mΩ ·cm2are achieved, resulting in a power figure of merit (PFOM) >2.12 GW/cm2. Furthermore, the large-area device with 3 × 3 mm2 is fabricated, achieving a BV exceeding 1.5 kV and a high forward current of 12 A at 2 V. The simplified fabrication process of the SFPM-SBD, combined with its outstanding performance, makes it a promising candidate for multikilovolt and ampere-class applications. © 1963-2012 IEEE.

Keyword:

Electric fields Etching Fabrication Gallium compounds Schottky barrier diodes

Community:

  • [ 1 ] [Han, Xueli]Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Key Laboratory of Materials for High Power Laser, Shanghai; 201800, China
  • [ 2 ] [Han, Xueli]University of Chinese Academy of Sciences, Center of Materials Science and Optoelectronics Engineering, Beijing; 100049, China
  • [ 3 ] [Xu, Xiaorui]Fuzhou University, College of Physics and Information Engineering, Fuzhou; 350116, China
  • [ 4 ] [Wang, Zhengbo]Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Key Laboratory of Materials for High Power Laser, Shanghai; 201800, China
  • [ 5 ] [Wang, Zhengbo]University of Chinese Academy of Sciences, Center of Materials Science and Optoelectronics Engineering, Beijing; 100049, China
  • [ 6 ] [Yang, Hanchao]Fuzhou University, College of Physics and Information Engineering, Fuzhou; 350116, China
  • [ 7 ] [Chen, Desen]Fuzhou University, College of Physics and Information Engineering, Fuzhou; 350116, China
  • [ 8 ] [Deng, Yicong]Fuzhou University, College of Physics and Information Engineering, Fuzhou; 350116, China
  • [ 9 ] [Chen, Duanyang]Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Key Laboratory of Materials for High Power Laser, Shanghai; 201800, China
  • [ 10 ] [Zhang, Haizhong]Fuzhou University, College of Physics and Information Engineering, Fuzhou; 350116, China
  • [ 11 ] [Qi, Hongji]Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Key Laboratory of Materials for High Power Laser, Shanghai; 201800, China
  • [ 12 ] [Qi, Hongji]Hangzhou Institute of Optics and Fine Mechanics, Hangzhou; 311421, China

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Source :

IEEE Transactions on Electron Devices

ISSN: 0018-9383

Year: 2025

Issue: 8

Volume: 72

Page: 4307-4312

2 . 9 0 0

JCR@2023

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ESI Highly Cited Papers on the List: 0 Unfold All

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Chinese Cited Count:

30 Days PV: 1

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