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author:

Tian, Fengqing (Tian, Fengqing.) [1] | Zhu, Yangbin (Zhu, Yangbin.) [2] | Xu, Zhongwei (Xu, Zhongwei.) [3] (Scholars:徐中炜) | Li, Baoyu (Li, Baoyu.) [4] | Zheng, Xiaojing (Zheng, Xiaojing.) [5] | Ni, Ziquan (Ni, Ziquan.) [6] | Hu, Hailong (Hu, Hailong.) [7] (Scholars:胡海龙) | Chen, Ying (Chen, Ying.) [8] | Zhuang, Jinyong (Zhuang, Jinyong.) [9] | Wu, Longjia (Wu, Longjia.) [10] | Fu, Dong (Fu, Dong.) [11] | Yan, Xiaolin (Yan, Xiaolin.) [12] | Li, Fushan (Li, Fushan.) [13] (Scholars:李福山)

Indexed by:

EI Scopus SCIE

Abstract:

In conventional quantum dot light-emitting diodes (QLEDs), the organic charge transport materials are susceptible to erosion by water and oxygen, which would reduce the efficiency and lifetime of the devices. Herein, we modified the surface of the organic hole transport layer with an ultra-thin Al2O3 layer, which is deposited by using atomic layer deposition technique, to obtain the highly efficient and stable QLEDs. It is indicated that the ultra-thin Al2O3 interlayer plays a significant role in decreasing leakage current, suppressing exciton quenching and passivating the defects. The device with Al2O3 interface modification exhibits the maximum external quantum efficiency (EQE) of 20.8%, current efficiency (CE) of 21.6 cd A(-1), and lifetime of 482000 h. In comparison with the control device, the EQE, CE and lifetime are improved by 31%, 32%, and 330%, respectively. The results indicate that the strategy of Al2O3 interface modification could provide an effective way for realizing highly efficiency QLED with long lifetime.

Keyword:

Aluminum oxide exciton quenching Excitons insulating layer Leakage currents Light emitting diodes Performance evaluation QLED quantum dots Quantum dots Surface treatment

Community:

  • [ 1 ] [Tian, Fengqing]Fuzhou Univ, Inst Optoelect Technol, Fuzhou 350116, Peoples R China
  • [ 2 ] [Zhu, Yangbin]Fuzhou Univ, Inst Optoelect Technol, Fuzhou 350116, Peoples R China
  • [ 3 ] [Xu, Zhongwei]Fuzhou Univ, Inst Optoelect Technol, Fuzhou 350116, Peoples R China
  • [ 4 ] [Zheng, Xiaojing]Fuzhou Univ, Inst Optoelect Technol, Fuzhou 350116, Peoples R China
  • [ 5 ] [Ni, Ziquan]Fuzhou Univ, Inst Optoelect Technol, Fuzhou 350116, Peoples R China
  • [ 6 ] [Hu, Hailong]Fuzhou Univ, Inst Optoelect Technol, Fuzhou 350116, Peoples R China
  • [ 7 ] [Li, Fushan]Fuzhou Univ, Inst Optoelect Technol, Fuzhou 350116, Peoples R China
  • [ 8 ] [Li, Baoyu]TCL Res Corp, Shenzhen 518067, Peoples R China
  • [ 9 ] [Chen, Ying]TCL Res Corp, Shenzhen 518067, Peoples R China
  • [ 10 ] [Zhuang, Jinyong]TCL Res Corp, Shenzhen 518067, Peoples R China
  • [ 11 ] [Wu, Longjia]TCL Res Corp, Shenzhen 518067, Peoples R China
  • [ 12 ] [Fu, Dong]TCL Res Corp, Shenzhen 518067, Peoples R China
  • [ 13 ] [Yan, Xiaolin]TCL Res Corp, Shenzhen 518067, Peoples R China

Reprint 's Address:

  • 李福山

    [Li, Fushan]Fuzhou Univ, Inst Optoelect Technol, Fuzhou 350116, Peoples R China

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Source :

IEEE ELECTRON DEVICE LETTERS

ISSN: 0741-3106

Year: 2020

Issue: 9

Volume: 41

Page: 1384-1387

4 . 1 8 7

JCR@2020

4 . 1 0 0

JCR@2023

ESI Discipline: ENGINEERING;

ESI HC Threshold:132

JCR Journal Grade:1

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count: 12

SCOPUS Cited Count: 14

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

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