The　deposition　rate　and　morphology　of　immersion　silver　plating　onto　copper　substrate　in　silver　nitrate　aqueous　solution　were　studied　by　galvanic　current　method　and　field　emission　scanning　electron　microscopy　(FE-SEM).　The　results　show　that　the　whole　deposition　process　can　be　divided　into　three　stages:　extending　growth,　transitional　growth　and　dendritic　growth.　The　deposition　rate　and　morphology　of　Ag　deposit　are　all　different　in　each　stage.　Initially,　the　adhesive　Ag　atoms　grow　along　the　lattice　of　copper　substrate.　Secondly,　the　substrate　is　spread　with　initial　silver　crystal　accompanied　with　two-dimension　growth.　Finally,　coarse　and　sponge-like　silver　plating　is　prepared　with　dendritic　growth.