In　the　study　of　chip　heat　dissipation,　micro-channel　heat　sinks　have　been　widely　used.　Microchannel　heat　sink　have　a　variety　of　structures,　among　which　the　manifold　structure　is　used　more　because　of　its　better　heat　dissipation　performance.　However,　the　manifold　structure　has　the　problem　of　uneven　flow　distribution.　In　order　to　solve　this　problem,　this　paper　uses　the　principle　of　similar　flow　resistance　and　resistance　to　establish　the　equivalent　resistance　model　of　the　manifold　microchannel.　This　model　simulates　the　equivalent　resistance　network　by　MATLAB,　simulates　the　change　of　the　flow　channel　by　changing　Rr,　simulates　the　change　of　the　distribution　channel　by　changing　Rd,　and　simulates　the　outlet　position　by　changing　the　position　of　the　negative　electrode　of　the　power　supply.　The　results　of　the　circuit　simulation　are　used　as　a　direction　guide,　and　thermal　simulation　is　performed　using　COMSOLTM.　The　optimization　of　the　reaction　channel,　the　distribution　channel　and　the　outlet　position　of　the　manifold　structure　is　completed.　Finally,　a　uniform　flow　distribution　was　achieved,　and　the　variance　of　the　surface　temperature　of　the　heat　source　was　reduced　by　66%.　It　can　be　seen　from　experiments　that　the　equivalent　resistance　model　has　an　important　role　in　guiding　the　optimization　direction　in　the　research　of　microchannel　heat　sink　with　manifold　structure.　©　2020　IEEE.