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author:

Gong, Chengpeng (Gong, Chengpeng.) [1] | Fan, Zhisong (Fan, Zhisong.) [2] (Scholars:范治松) | Cheng, Li (Cheng, Li.) [3] | Deng, Jianghua (Deng, Jianghua.) [4] (Scholars:邓将华)

Indexed by:

EI SCIE

Abstract:

Electromagnetic riveting (EMR) is a mechanical joining technique. The riveting force of the EMR is dependent on the electromagnetic repulsion force between a coil and a driver plate. In this work, a numerical analysis model of the total electromagnetic repulsion force of the EMR is derived based on the theories of circuit and electro-magnetics and dynamics. The model takes account of many influential parameters that affect electromagnetic repulsion force, not only discharging parameters such as voltage, resistance, inductance, and capacitance, but also the geometry of the coil and the driver plate. A variety of calculated results, such as current, total elec-tromagnetic repulsion force, impact-velocity and rivet deformation, can be handily calculated. The EMR ex-periments are conducted to verify the numerical analysis model. The compared results show that the numerical results are in good agreement with the experimental values. Such an analytical model helps to control the total electromagnetic repulsion force, as well as provides scientific guidance for parameter optimization and structural design.

Keyword:

Electromagnetic riveting Numerical analysis model Parameter optimization Total electromagnetic repulsion force

Community:

  • [ 1 ] [Gong, Chengpeng]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350100, Peoples R China
  • [ 2 ] [Fan, Zhisong]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350100, Peoples R China
  • [ 3 ] [Cheng, Li]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350100, Peoples R China
  • [ 4 ] [Deng, Jianghua]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350100, Peoples R China

Reprint 's Address:

  • 范治松 邓将华

    [Fan, Zhisong]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350100, Peoples R China;;[Deng, Jianghua]Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350100, Peoples R China

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Source :

JOURNAL OF MANUFACTURING PROCESSES

ISSN: 1526-6125

Year: 2021

Volume: 69

Page: 656-670

5 . 6 8 4

JCR@2021

6 . 1 0 0

JCR@2023

ESI Discipline: ENGINEERING;

ESI HC Threshold:105

JCR Journal Grade:2

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count: 4

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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