Microcapsules　loading　with　healing　agents　are　constantly　used　in　engineered　self-healing　materials.　But　the　synthesis　of　epoxy　resin　composites　with　excellent　self-healing　effect　remains　a　major　challenge.　In　this　paper,　3-(Trimethoxysilyl)propyl　methacrylate　(KH570)　was　used　to　modify　the　nano　silica　(KHSI)　for　increasing　lip-ophilicity.　Then　by　using　water-in-oil　method,　the　inverse　Pickering　emulsion　was　stabilized　by　KHSI,　and　the　core-shell　double　microcapsules　(CS-DMics)　loaded　with　different　healing　agents　were　formed　via　1,1-Bis(acryl-oyloxymethyl)ethyl　isocyanate　(BEI).　SEM　and　particle　size　statistical　show　that　the　size　range　of　CS-DMics　is　10-149.25　mu　m.　Ultimately,　the　self-healing　epoxy　resin　compound　(Sh-ERC)　was　acquired　by　combining　CS-DMics　with　epoxy　resin　substrate　materials.　The　thermal　properties,　mechanical　properties,　self-healing　prop-erties　and　electrical　conductivity　were　tested.　It　is　found　that　Sh-ERC　has　perfect　self-healing　performance　when　the　cracks　occur　and　the　microcapsules　release　healing　agent　for　repairing.　The　self-healing　effect　of　Sh-ERC　is　better　with　more　CS-DMics　content,　and　the　self-healing　efficiency　is　up　to　86.5%　when　the　content　of　CS-DMics　is　40%.　It　has　an　excellent　self-healing　performance　for　engineering　materials.