Preparation　of　polymer-based　packaging　materials　with　rapid　heat　dissipation　capacity　is　crucial　for　ensuring　high-power　equipment＇s　service　life.　To　achieve　this,　boron　nitride　(BN)　and　multi-walled　carbon　nanotubes　(MWCNTs)　were　used　in　different　ratios　to　prepare　thermally　conductive　epoxy　composites.　These　composites　were　created　through　a　simple　mixing　and　curing　process,　resulting　in　a　heat　transmission　path.　Then,　BN　and　MWCNTs　were　separately　functionalized　with　dopamine　and　acid　to　enhance　their　dispersibility　and　interfacial　compatibility　within　the　epoxy　resin.　This　was　done　to　further　explore　their　influence　on　the　formation　of　serial　heat　transfer　pathways.　The　BN/MWCNTs/epoxy　composites　with　a　filler　ratio　of　15:1　and　a　total　filler　loading　of　30　wt　%　exhibited　a　thermal　conductivity　of　0.92　W/mK,　which　is　118%　higher　than　pure　epoxy.　These　composites　also　displayed　favorable　mechanical　properties　and　thermal　stability.　This　study　provides　guidance　for　designing　high-performance　epoxy　composites　to　meet　modern　electronic　devices＇　thermal　management　requirements.