It　is　a　great　challenge　to　develop　thermal　interface　materials　that　enable　fast　heat　transfer　between　the　surface　of　microelectronic　materials　and　heat　sinks.　In　this　paper,　multi-walled　carbon　nanotube/epoxy　composites　(EPNH2-x)　were　synthesized　by　amidation　reaction　using　aminated　epoxy　resin　as　matrix　and　carboxylated　multiwalled　carbon　nanotubes.　EP-NH2-x　can　reduce　the　interfacial　thermal　resistance　and　the　promotion　of　phonon　conduction　through　the　chemical　bonding　connection　between　the　resin　and　the　carbon　nanotubes,　which　will　in　turn　improve　the　thermal　conductivity　of　the　composites.　The　thermal　conductivity　of　EP-NH2-10　reaches　0.531　W　&　sdot;m-　1　&　sdot;K-　1　at　a　and　has　good　variable　temperature　cycling　stability,　internal　elasticity　and　surface　adhesion.　This　work　highlights　the　potential　application　of　carbon　materials　to　improve　the　thermal　conductivity　of　epoxy　resins.