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author:

Xiang, Hongliang (Xiang, Hongliang.) [1] (Scholars:向红亮) | Rao, Shaohui (Rao, Shaohui.) [2] | Zheng, Kaikui (Zheng, Kaikui.) [3] (Scholars:郑开魁) | Liu, Dong (Liu, Dong.) [4] (Scholars:刘东)

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EI PKU CSCD

Abstract:

Different types of antibacterial super duplex stainless steel materials were prepared by adding different contents of Cu to UNS S33207 super duplex stainless steel and undergoing solid solution and antibacterial aging treatment. The optical microscope(OM), scanning electron microscope(SEM), transmission electron microscope (TEM), coating method, ICP-MS mass spectrometer, electrochemical test and other methods were used to study the effect of Cu content on the organization, antibacterial and corrosion resistance of UNS S33207 material. The results show that the number of precipitated copper-rich phases increases with the increase of Cu content; when the Cu content is less than 2.55%(mass fraction), the copper-rich phases preferentially precipitate in the ferrite and phase boundaries. When the Cu content is further increased, the copper-rich phase will precipitate in the austenite; the size of the copper-rich phase precipitated in the ferrite is tens of nanometers, and the shape is spherical or ellipsoidal with a stable FCC structure, and the matrix is a non-coherent relationship. With the increase of Cu content, the dissolution rate of Cu ions increases, which results in the increase of antibacterial performance of the material, and its antibacterial rate increases with the prolongation of the action time with the bacterial liquid. The the copper-rich phase is a weak point in the passivation film. The more its content, the worse the corrosion resistance of the material. The Cu content should be appropriate to ensure the normal and relevant performance of the material. © 2022 Central South University of Technology. All rights reserved.

Keyword:

Copper corrosion Corrosion resistance Ferrite Heavy ions Passivation Scanning electron microscopy Steel corrosion Transmission electron microscopy

Community:

  • [ 1 ] [Xiang, Hongliang]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350108, China
  • [ 2 ] [Xiang, Hongliang]Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou; 350108, China
  • [ 3 ] [Xiang, Hongliang]School of Advanced Manufacturing, Fuzhou University, Jinjiang; 362200, China
  • [ 4 ] [Rao, Shaohui]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350108, China
  • [ 5 ] [Zheng, Kaikui]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350108, China
  • [ 6 ] [Zheng, Kaikui]Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou; 350108, China
  • [ 7 ] [Zheng, Kaikui]School of Advanced Manufacturing, Fuzhou University, Jinjiang; 362200, China
  • [ 8 ] [Liu, Dong]School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou; 350108, China

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Source :

Journal of Central South University (Science and Technology)

ISSN: 1672-7207

CN: 43-1426/N

Year: 2022

Issue: 8

Volume: 53

Page: 2886-2897

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 1

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

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