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author：

Wang, S. (Wang, S..) [1] | Lin, C. (Lin, C..) [2] | Lu, Y. (Lu, Y..) [3] | Sun, J. (Sun, J..) [4] (Scholars：孙捷) | Yan, Q. (Yan, Q..) [5] | Zhang, K. (Zhang, K..) [6] | Huang, Z. (Huang, Z..) [7] | Yang, T. (Yang, T..) [8] | Guo, T. (Guo, T..) [9] (Scholars：郭太良)

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EI Scopus

Abstract：

In　this　study,　in　order　to　achieve　high-yield　Micro-LED　chip　bonding　and　thus　further　advance　the　breakthrough　of　Micro-　LED　interconnect　technology.　In　this　study,　an　electroless　plating　method　is　used　to　achieve　the　highly　uniform　nickel　bump　arrays　on　thin　film　transistor　(TFT)　driver　substrate.　Initially,　the　photoresists　AZ4620　and　AZ2070　are　chosen　for　the　experiments,　which　can　cover　the　step　structure　uniformly　of　TFT　substrate.　Subsequently,　the　morphology　of　bumps　on　the　TFT　substrate　influenced　by　the　plasma　treatment　and　the　deposition　time　is　investigated.　The　1%　uniformity　of　the　nickel　bump　arrays　by　the　electroless　plating　for　30　minutes　after　5-minute　plasma　treatment　is　achieved,　which　lays　the　foundation　for　the　electroless　plating　self-bonding.　©　2024　John　Wiley　and　Sons　Inc.　All　rights　reserved.

Keyword：

Electroless Plating: Nickel Bump Highly Uniform Micro-LED

Community：

  • [ 1 ] [Wang S.]National and Local United Engineering Laboratory of Flat Panel Display Technology, Fuzhou University, Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
  • [ 2 ] [Lin C.]National and Local United Engineering Laboratory of Flat Panel Display Technology, Fuzhou University, Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
  • [ 3 ] [Lu Y.]National and Local United Engineering Laboratory of Flat Panel Display Technology, Fuzhou University, Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
  • [ 4 ] [Sun J.]National and Local United Engineering Laboratory of Flat Panel Display Technology, Fuzhou University, Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
  • [ 5 ] [Sun J.]Quantum Device Physics Laboratory, Department of Microscience and Nanotechnology, Chalmers University of Technology, Göteborg, Sweden
  • [ 6 ] [Yan Q.]National and Local United Engineering Laboratory of Flat Panel Display Technology, Fuzhou University, Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
  • [ 7 ] [Zhang K.]National and Local United Engineering Laboratory of Flat Panel Display Technology, Fuzhou University, Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
  • [ 8 ] [Huang Z.]National and Local United Engineering Laboratory of Flat Panel Display Technology, Fuzhou University, Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
  • [ 9 ] [Yang T.]National and Local United Engineering Laboratory of Flat Panel Display Technology, Fuzhou University, Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
  • [ 10 ] [Guo T.]National and Local United Engineering Laboratory of Flat Panel Display Technology, Fuzhou University, Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China

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ISSN： 0097-966X

Year： 2024

Issue： S1

Volume： 55

Page： 194-196

Language： English

Cited Count：

WoS CC Cited Count：

SCOPUS Cited Count：

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 2

Affiliated Colleges：

物理与信息工程学院、微电子学院 本学院/部未明确归属的数据

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