This　study　aims　to　achieve　high-yield　micro-LED　chip　bonding　and　thus　further　advance　the　innovation　of　micro-LED　interconnection　technology.　In　this　research,　an　electroless　plating　method　was　used　to　achieve　the　highly　uniform　nickel　bump　arrays　on　a　thin-film　transistor　(TFT)　driver　substrate.　Initially,　the　photoresists　AZ4620　and　AZ2070　are　chosen　for　the　experiments,　which　can　cover　the　step　structure　uniformly　of　TFT　substrate.　Subsequently,　the　shape　of　bumps　on　the　TFT　substrate　influenced　by　the　plasma　treatment　and　the　deposition　time　was　investigated.　The　result　indicated　that　microbump　arrays　with　a　uniformity　of　less　than　1%　could　be　successfully　fabricated　by　employing　a　5-min　plasma　treatment　and　incorporating　surfactant　additions　at　concentrations　of　0.02%,　and　the　process　of　preparation　has　a　high　repeatability,　which　lays　a　solid　foundation　for　the　subsequent　electroless　plating　bonding,　and　provides　a　critical　reference　for　the　breakthrough　of　micro-LED　interconnection　key　technology.