Large-　scale　integration　of　microbattery　systems　on　chips　has　long　been　hindered　by　the　technical　barrier　between　electrochemistry　and　microelectronics,　particularly　in　terms　of　the　compatibility　of　microbattery　cells　and　their　collective　manufacturability.　In　this　work,　a　silicon-　based　all-　solid-　state　thin-　film　microbattery　cell　is　developed　at　low　temperatures　for　on-　chip　integration　applications.　Stress　management　at　the　interfaces　covering　both　the　resistance　to　interfacial　fracture　and　the　stress　dissipation　through　strain　regulation　enables　microbattery　cells　to　deliver　a　high-　rate　performance　(34.4　mA　cm-2),　fast　charge-discharge　properties　(1,000,000　cycles　at　20　mA　cm-2),　and　high-　temperature　tolerance　(150　degrees　C)　under　zero　stack　pressure.　An　intrinsic　relationship　among　lithium　utilization　ratio,　strain,　stress,　and　interface　manifestation　is　uncovered.　A　collective　microfabrication　protocol　for　on-　chip　microbattery　packs　is　proposed,　resulting　in　a　prototype　of　series-　connected　microbattery　packs.　This　work　focuses　on　practically　addressing　the　technologies　and　challenges　in　engineering　on-　chip　microbattery　systems　for　large-　scale　integration.